High Density Interconnection (HDI) PCBs include finer structures and smaller vias.
The continuing miniaturisation and ever more complex circuits would not be possible without the application of laserdrilled microvias.
The microvia technology is necessary to produce printed circuit boards with a very high wiring density.
In the case of modern electronic components with a high number of I/O ports the land design is made with via-in-pads.

Standard Microvia

Interconnects two layers

Staggered Vias

Thanks to staggeredly arranged vias, multiple layers can be interconnected.

Stacked Vias

Multiple numbers of filled microvias are stacked on top of each other at one location to increase density.

Skip Vias

Connection from layer x to layer x+2 or +3.
Here, the inner layers can also be connected, resulting in a higher adhesive strength of the microvias.

Copper-filled microvias

Interconnects two layers. Additional advantages compared to standard microvias:

  • Requires less space
  • Enables via-in-pad
  • High reliability

> More information.


Printed circuit boards can be covered by different surface finishes. The decision on surface treatments
is mainly determined by the subsequent processes.