October 6, 2017
The second workshop of the PCB Technology Tour 2017 of the EES group took place on September 28 on the premises of Schoeller Electronics Systems.
We are very pleased that our topics met great interest with our customers from Research, Development and also Purchasing departments.
Mr Wittenberg, Technical Director at ggp Electronics, reported about Nano Polymer Thick Film Paste, Mr Künkel at R & D at SES held a presentation on flexible and rigid-flexible printed circuit boards.
After a plant tour Mr Wille, Head of R & D at SES, presented the topic High Efficient Heat Dissipation on Printed Circuit Boards.
During the whole workshop there was an interesting exchange of ideas and discussions about practical experience, trends and developments as well as the framework requirements of tomorrow.
With this series of presentations which takes place in Germany for the first time in 2017 we would like to create a platform which will allow us and all interested persons to exchange views actively and directly. ”Our focus here lies 100 % on the exchange of technical feasibility and solutions, regardless of supplier and objectively”, so Guido Biernat, Sales Director at SES.
At this point we would like to thank all participants and speakers for their participation and their commitment.