NEWS

INVITATION TO EMBEDDED WOLRD TRADEFAIR

We are pleased to announce that EES will present its capabilities again at the Embedded World Tradefair from February 26 to 28, 2019 in Nuremberg. We welcome you as our guests to discuss the latest technical trends and to inform you about the latest activities and investments at EES to support the increasing requirements in performance critical products. Plan your meeting with us ahead and drop us your meeting request through info@ees-pcb.com.

You will find us in hall 3 at booth 747.

Invitation to Embedded Tradefair

The IoT is here – its growing rapidly and it´s going to be even more awesome. The global coming together of Information Technology , Artifical Intelligence and Telecommunications is already facilitating machine centric communications and decision making. Here in EES-PCB we are enabled hardware designers to meet the functionality and speeds demanded by the IoT.

 

Visit the EES-PCB booth at: 

https://www.embedded-world.de/en/become-visitor 

 

Learn how our Product Engineers can assist the design of your hardware, using advanced laminates and PCB interconnection strategies that maximize signal integrity and facilitate thermal management.

At EES-PCB we don’t just fabricate PCB’s – we enable solutions. Join us at “embedded world 2018” on booth 249 in hall 3. 

 

EES-PCB “Concepts – Perfectly Connected”.

Update on EES Group

As we begin 2018 we at EES-PCB can reflect with pride on the achievements of 2017, our 1 st full year of business, and with confidence that while much has been achieved, there is much more still to come.

Our “perfectly connected” philosophy has seen our group achieve synergies in Purchasing, Business Development and Financial Planning and the integration of our QTA services from Kiel with our medium volume series production in Osterode

Wetter enhancing our service offering to all customers. With the strong support of our owners we are significantly improving our manufacturing
capabilities, adding automation & enhancements and did determine our latest CAPEX Plan for 2018.

Our EES Asia activities are recently under re-definition in order to define and deploy a sustainable long term solution for performance critical products. Our global reach has extended and we have enjoyed new customer visits from Ireland, the UK and USA, as our collaborative product development service approach, resonates with companies that operate in the demanding NPI cycles of this dynamic industry.

Most recently our management team has been strengthened with the addition of Mr Mario Kramer as VP Marketing & Sales and we will continue to add skilled and experienced personnel to achieve our EES-PCB vision “Perfectly Connected”.