Techniques for Heat Dissipation
To a great extent, the development in the electronics industry is driven by miniaturisation questions, resulting in ever higher power losses per unit area.
To dissipate the developing heat at reasonable costs and with high efficiency, EES offers different solution concepts which can be integrated into the constructive design of the printed circuit board.
The simultaneous application of different variants allows it to combine and individually adapt thermal characteristics.
„We offer solutions to
dissipate heat at reasonable
costs and with high efficiency.“
High Density Interconnection (HDI) PCBs include finer structures and smaller vias.
The continuing miniaturisation and ever more complex circuits would not be possible without the application of laserdrilled microvias.
The microvia technology is necessary to produce printed circuit boards with a very high wiring density.
In the case of modern electronic components with a high number of I/O ports the land design is made with via-in-pads.
Interconnects two layers
Thanks to staggeredly arranged vias, multiple layers can be interconnected.
Multiple numbers of filled microvias are stacked on top of each other at one location to increase density.
Connection from layer x to layer x+2 or +3.
Here, the inner layers can also be connected, resulting in a higher adhesive strength of the microvias.
Interconnects two layers. Additional advantages compared to standard microvias:
- Requires less space
- Enables via-in-pad
- High reliability
Printed circuit boards can be covered by different surface finishes. The decision on surface treatments
is mainly determined by the subsequent processes.