PRODUCTS

DOUBLE - SIDED
PCB

Double-sided printed circuit boards consist of two Cu-layers which are connected by plated through holes. They are mostly used in simple technologies and mass media.

 

MULTILAYER

EES manufactures standard multilayer and high-technology multilayer PCBs.
Standard multilayer PCBs are produced homogeneously of one type of material. Materials range from standard FR-4 to halogen-free High Tg material.

Step by step, the implementation of manufacturing processes such as HDI, SBU technology, buried and blind vias, resin-filled or copper-filled vias, mixed superstructures (hybrid technology) and special characteristics such as defined impedances, capacities or inductances as well as shieldings results in a high-technology multilayer.

 

Hightech Multilayer

  • > 8 layers
  • High-layered
  • HDI technology
  • High temperature-resistant materials
  • Sturdiness, resulting in a high temperature cycle reliability
  • Sub lam technology
  • Sequential build-up technique
  • Buried vias, blind vias

Standard Multilayer

  • < 8 layers
  • Suitable for lead-free soldering
  • HDI / SBU technology

FLEX
PCB

Flexible PCBs can be manufactured as single-sided, double-sided or multilayer flexible circuit boards. This allows the complete wiring of compact devices and systems with the advantage that no additional cables or connectors will be required.

Thanks to the flexibility of the layers, static or permanent dynamic bends are possible, offering additional functionality depending on the individual case of application. In addition to the usual connection of electronic components, flexible PCBs can also take over mechanical tasks, such as the access to components at the housing of devices.

With this connection technology, narrow installation space can be used perfectly as these flexible PCBs allow a three-dimentional installation (3D assemblies).

Flexible circuit boards can be also designed in HDI and SBU technology with very fine line pattern and ultra thin dielectric materials.

 

Machining of contours

• Milling
• Punching
• Laser cutting

ZIF connector

• Zero insertion force connector
• Electroplated ZIF connector

 

Polyflex and finger flex circuits

•   Directly pluggable contact fingers up to
     250 μm

 

Flexible PCB with assembly frame

  • Easy assembly

RIGID
FLEX

Conventional wiring systems usually require a lot of space of the limited installation volume which is available and are therefore not always the best solution.
These cases require printed circuit boards which allow a three-dimensional installation and this way fully utilize the available space and which offer more freedom of design with rigid-flexible PCBs.

This family of circuit boards provides the highest flexibility in design and application and also the highest robustness in the circuit board technology.

HDI and SBU techniques are also possible.

 

Symmetrical layer construction

  • Higher planarity thanks to the symmetrical layer construction and the rigid material on both external layers
  • Higher flexibility as the flexible layers are not covered with an additional galvanic copper layer
  • Higher reliability at the solder bath test (stress) and the temperature change test (shock)
  • For technical reasons, high-layered rigid-flexible PCBs with numerous flexible layers should always be constructed symmetrically

 

Asymmetrical construction

  • Low production costs
  • Cost efficient construction
  • Easy to use in the further processing chain
  • Snap-out technology is possible

 

Flexible area fanned out

  • Can be manufactured fanned out or laminated together

 

High-speed signal transmission

  • Flexible and rigid-flexible PCBs for high-speed transmission
  • Alternative to cable harnesses
  • Saving of weight ≥ 70%

RF &
MICROWAVE

High-frequency and microwave circuits have to process electromagnetic
waves with low signal power in the frequency range of several GHz at low loss.
The signals used in radar engineering are of even higher frequencies.

Printed circuit boards with defined transmission characteristics are employed to transmit high-frequency signals:

  • Transmission lines
  • Substrates with low dielectric losses
  • Multilayer with mixed dielectrics (hybrid multilayers)

Simple high-frequency microwave circuit with teflon

  • PTFE-containing and PTFE-free materials with exceptionally low loss factors

Mixed dielectric superstructures

  • Combination of different materials
  • Save costs by intelligent material usage

Heat dissipation

  • Different types of heat dissipation concepts
  • Different possibilities to integrate metal pieces for heat dissipation

DOUBLE-SIDED
PCB

MULTILAYER

FLEX PCB

RIGID FLEX

RF &
MICROWAVE