EES attended the “Advancements in Thermal Management 2017” conference in Denver Colorado on August 10th. Markus Wille – Head of R&D – was keynote speaker on day 2 and outlined in a 45 minute presentation, to an attentive audience of > 100 delegates, the advantages of local coin solutions and the practical implementation of solutions within EES.

The annual event experienced the largest show attendance to date and the technical competence of delegates demonstrated during the interactive Q&A’s was extremely impressive. A show not to be missed. The delegate attendance comprised of a very diverse range of disciplines from “blue chip” US OEM’s with a smattering of European participants.

EIPC Summer Conference 2017

Thermal Management Solutions

Padraig McCabe, Business Development Engineer with Schoeller Electronics Systems in Germany presented thermal management solutions at EIPC Summer Conference 2017 in Birmingham.

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